Specialised in 3D-MID
News
MID in pole position
Three-dimensional molded interconnect devices (MID) are a welcome addition to conventional printed circuit boards and are particularly well suited to Industry 4.0 applications. The example of a smoke detector illustrates how design and functional integration are simplified with this technology.
Exhibitions Italy
Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017. Visit us at: Illuminotronica & Expo Ferroviaria
Production
In-House-Production
MULTIPLE DIMENSIONS is committed to cost-effective serial production. This is achieved with state-of-the-art infrastructure and holistic production under one roof.
MULTIPLE DIMENSIONS is committed to cost-effective serial production. This is achieved with state-of-the-art infrastructure and holistic production under one roof.