Specialised in 3D-MID
News
3D MID supports miniaturization
MULTIPLE DIMENSIONS AG, with its 3D MID (Molded Interconnect Devices) technology, supports modularization and miniaturization of electronics. Product developers extend forms from flat conventional forms into three dimensions and enjoy the highest degree of design freedom.
3D-MID @ Electronica in Munich
From November 8th – 11th get informed in the halls of Electronica on the exciting trends and latest developments of 3D-MID technology.
Production
In-House-Production
MULTIPLE DIMENSIONS is committed to cost-effective serial production. This is achieved with state-of-the-art infrastructure and holistic production under one roof.
MULTIPLE DIMENSIONS is committed to cost-effective serial production. This is achieved with state-of-the-art infrastructure and holistic production under one roof.