Visit us in hall 6 booth 318 and discover the potential that’s offered by the 3D-MID technology (Molded Interconnect Device)! At the SMT / Hybrid Packaging in Nuremberg we show how you can optimize your products by the use of 3D-MID.
The trend toward miniaturization and functional integration in the electronic industry is unbeaten. 3D-packaging, Package on Package (PoP) or System in Package (SiP) are key technologies to realize high functional integration into the smallest space, but PoP or SiP deal with packaging on chip level only. The chip itself has to be assembled to a