Multiple Dimensions

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3D-MID on Electronica 2016

Electronica 2016

Posted on 30. November 2016 by Thomas Hess
The Multiple Dimensions team thanks for the numerous visits at the Electronica 2016 in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology. Insight in 3D-MID production
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Posted in Exhibition
3D-MID @ Electronica

3D-MID @ Electronica in Munich

Posted on 23. May 2016 by Thomas Hess
From November 8th – 11th get informed in the halls of Electronica on the exciting trends and latest developments of 3D-MID technology.
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Posted in Exhibition

SMT Hybrid Packaging April 26th – 28th

Posted on 14. April 2016 by Thomas Hess
Visit us in hall 6 booth 318 and discover the potential that’s offered by the 3D-MID technology (Molded Interconnect Device)! At the SMT / Hybrid Packaging in Nuremberg we show how you can optimize your products by the use of 3D-MID.
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Posted in Exhibition

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CONTACT

Multiple Dimensions AG
Erlenstrasse 44
2555 Brügg/Biel, Schweiz
Telefon +41 32 552 07 50

info@multipledim.com

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