


3D MID supports miniaturization
Innovation breakthrough in circuit carriers
MULTIPLE DIMENSIONS AG, with its 3D MID (Molded Interconnect Devices) technology, supports modularization and miniaturization of electronics. Product developers extend forms from flat conventional forms into three dimensions and enjoy the highest degree of design freedom.

3D-Packaging with 3D-MID Technology
The trend toward miniaturization and functional integration in the electronic industry is unbeaten. 3D-packaging, Package on Package (PoP) or System in Package (SiP) are key technologies to realize high functional integration into the smallest space, but PoP or SiP deal with packaging on chip level only. The chip itself has to be assembled to a