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LDS Antenna Design

LDS Antenna Design

Posted on 17. October 2017 by Thomas Hess

LDS Antenna Design

Antenna design with Laser Direct Structuring (LDS) technology offers the designers a huge flexibility. The LDS technology is the most powerful 3D manufacturing technology available.
In the past decade, over 1 Billion LDS antennas have been produced. With LDS technology, antenna designers are enabled to create very powerful antenna designs with new degrees of freedom in three-dimensions.  Multi-band, Wi-Fi, Bluetooth, GSM, CDMA, Cellular 3G, 4G LTE and emerging 5G frequencies are served.  LDS antennas cover the full spectrum of todays and tomorrow’s mobile RF devices.
LDS has the power reduce component count and miniaturize RF devices.  When selecting an LDS antenna the designer dispenses with additional Flex PCB or wire antennas.  The conductive surface is applied directly on the thermoplastic substrate.  With LDS, the structure is the substrate.  A total cost analysis confirms that LDS function integration and flexibility saves money. The power of LDS flexibility is also seen in the design phase – multiple antenna iterations can be laid down on the 3D structure in one batch, helping antenna designers secure the best performing antenna length and shape.  LDS technology gives our clients the power to design and deliver great RF antenna performance quickly and reduce Time-to-Market. LDS technology is used in a great variety of antenna applications including:
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Function integration and miniaturization with 3D MID

3D MID supports miniaturization

Posted on 24. May 2016 by Thomas Hess

Innovation breakthrough in circuit carriers

MULTIPLE DIMENSIONS AG, with its 3D MID (Molded Interconnect Devices) technology, supports modularization and miniaturization of electronics. Product developers extend forms from flat conventional forms into three dimensions and enjoy the highest degree of design freedom.

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MEMS packaging with 3D-MID

3D-Packaging with 3D-MID Technology

Posted on 11. October 2014 by Thomas Hess
The trend toward miniaturization and functional integration in the electronic industry is unbeaten. 3D-packaging, Package on Package (PoP) or System in Package (SiP) are key technologies to realize high functional integration into the smallest space, but PoP or SiP deal with packaging on chip level only. The chip itself has to be assembled to a
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2555 Brügg/Biel, Schweiz
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