10.07.2017
Exhibitions Italy
Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017.
Visit us at:
Illuminotronica & Expo Ferroviaria
19.06.2017
MID in pole position
Three-dimensional molded interconnect devices
Three-dimensional molded interconnect devices (MID) are a welcome addition to conventional printed circuit boards and are particularly well suited to Industry 4.0 applications. The example of a smoke detector illustrates how design and functional integration are simplified with this technology.
21.04.2017
Join Multiple Dimensions at DMEMS May 3 & 4 in Del Mar (CA)
Come visit us at Booth #754 !
The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.
30.11.2016
Electronica 2016
The Multiple Dimensions team thanks for the numerous visits at the Electronica 2016 in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.
28.05.2016
Certificate of Quality ISO/TS 16949
ISO/TS Certification
Our Claim: Maximum product and service quality
Innovation, quality and deliveries across the entire supply chain are crucial for success in the international automotive industry.
