Join Multiple Dimensions at DMEMS May 3 & 4 in Del Mar (CA)
Come visit us at Booth #754 !
The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.
The Multiple Dimensions team thanks for the numerous visits at the Electronica fair in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.
Certificate of Quality ISO/TS 16949
Our Claim: Maximum product and service quality
Innovation, quality and deliveries across the entire supply chain are crucial for success in the international automotive industry.
3D MID supports miniaturization
Innovation breakthrough in circuit carriers
MULTIPLE DIMENSIONS AG, with its 3D MID (Molded Interconnect Devices) technology, supports modularization and miniaturization of electronics. Product developers extend forms from flat conventional forms into three dimensions and enjoy the highest degree of design freedom.
3D-MID @ Electronica in Munich
From November 8th – 11th get informed in the halls of Electronica on the exciting trends and latest developments of 3D-MID technology.