Innovative Technology 3D-MID shown on two expos in Italy

Exhibitions Italy

Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017.

Visit us at:

Illuminotronica & Expo Ferroviaria

Konzept eines Rauchmelders basierend auf 3D-MID-Technologie

MID in pole position

Three-dimensional molded interconnect devices

Three-dimensional molded interconnect devices (MID) are a welcome addition to conventional printed circuit boards and are particularly well suited to Industry 4.0 applications. The example of a smoke detector illustrates how design and functional integration are simplified with this technology.

3D-MID-Technology showed by Multiple Dimensions

Join Multiple Dimensions at DMEMS May 3 & 4 in Del Mar (CA)

Come visit us at Booth #754 !

The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.

3D-MID on Electronica 2016

Electronica 2016

The Multiple Dimensions team thanks for the numerous visits at the Electronica 2016 in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.

Insight in 3D-MID production

3D-MID for automotive

Certificate of Quality ISO/TS 16949

ISO/TS Certification

Our Claim: Maximum product and service quality

Innovation, quality and deliveries across the entire supply chain are crucial for success in the international automotive industry.

Quality certificate TS16949
Certificate for Automotive industry