Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017.
Visit us at:
Illuminotronica & Expo Ferroviaria
MID in pole position
Three-dimensional molded interconnect devices
Three-dimensional molded interconnect devices are a welcome addition to conventional printed circuit boards and are particularly well suited to Industry 4.0 applications. The example of a smoke detector illustrates how design and functional integration are simplified with this technology.
Join Multiple Dimensions at DMEMS May 3 & 4 in Del Mar (CA)
Come visit us at Booth #754 !
The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.
The Multiple Dimensions team thanks for the numerous visits at the Electronica fair in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.
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