Innovative Technology 3D-MID shown on two expos in Italy

Exhibitions Italy

Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017.

Visit us at:

Illuminotronica & Expo Ferroviaria

Konzept eines Rauchmelders basierend auf 3D-MID-Technologie

MID in pole position

Three-dimensional molded interconnect devices

Three-dimensional molded interconnect devices are a welcome addition to conventional printed circuit boards and are particularly well suited to Industry 4.0 applications. The example of a smoke detector illustrates how design and functional integration are simplified with this technology.

3D-MID-Technology showed by Multiple Dimensions

Join Multiple Dimensions at DMEMS May 3 & 4 in Del Mar (CA)

Come visit us at Booth #754 !

The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.

3D-MID on Electronica

Electronica 2016

The Multiple Dimensions team thanks for the numerous visits at the Electronica fair in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.

3D-MID for automotive

Certificate of Quality ISO/TS 16949

ISO/TS Certification

Our Claim: Maximum product and service quality

Innovation, quality and deliveries across the entire supply chain are crucial for success in the international automotive industry.

Quality certificate TS16949
Certificate for Automotive industry