3D-MID-Technology showed by Multiple Dimensions

21.04.2017
Join Multiple Dimensions at DMEMS May 3 & 4 in Del Mar (CA)

Come visit us at Booth #754 !

The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.


3D-MID on Electronica

30.11.2016
Electronica 2016

The Multiple Dimensions team thanks for the numerous visits at the Electronica fair in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.


3D-MID for automotive

28.05.2016
Certificate of Quality ISO/TS 16949

ISO/TS Certification

Our Claim: Maximum product and service quality

Innovation, quality and deliveries across the entire supply chain are crucial for success in the international automotive industry.

Quality certificate TS16949
Certificate for Automotive industry

Function integration and miniaturization with 3D MID

24.05.2016
3D MID supports miniaturization

Innovation breakthrough in circuit carriers

MULTIPLE DIMENSIONS AG, with its 3D MID (Molded Interconnect Devices) technology, supports modularization and miniaturization of electronics. Product developers extend forms from flat conventional forms into three dimensions and enjoy the highest degree of design freedom.


3D-MID @ Electronica

23.05.2016
3D-MID @ Electronica in Munich

From November 8th – 11th get informed in the halls of Electronica on the exciting trends and latest developments of 3D-MID technology.