Innovative Technology 3D-MID shown on two expos in Italy

10.07.2017
Exhibitions Italy

Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017.

Visit us at:

Illuminotronica & Expo Ferroviaria


Konzept eines Rauchmelders basierend auf 3D-MID-Technologie

19.06.2017
MID in pole position

Three-dimensional molded interconnect devices

Three-dimensional molded interconnect devices are a welcome addition to conventional printed circuit boards and are particularly well suited to Industry 4.0 applications. The example of a smoke detector illustrates how design and functional integration are simplified with this technology.


3D-MID-Technology showed by Multiple Dimensions

21.04.2017
Join Multiple Dimensions at DMEMS May 3 & 4 in Del Mar (CA)

Come visit us at Booth #754 !

The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.


3D-MID on Electronica

30.11.2016
Electronica 2016

The Multiple Dimensions team thanks for the numerous visits at the Electronica fair in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.


3D-MID for automotive

28.05.2016
Certificate of Quality ISO/TS 16949

ISO/TS Certification

Our Claim: Maximum product and service quality

Innovation, quality and deliveries across the entire supply chain are crucial for success in the international automotive industry.

Quality certificate TS16949
Certificate for Automotive industry