We are pleased to welcome you on the Electronica exhibition – hall C4, booth 173 – and would be very glad to present our news about technologies, products and services. The exhibition takes place from November 13th till 16th in Munich.
Examples of 3D-MID applications reveal almost limitless potentialIn the manufacture of industrial applications, more and more industry sectors are turning to a new technology as an alternative to classic PCBs. The revolution is called 3-D MID (Mechatronic Integrated Devices) – injection-moulded plastic parts with conductive traces integrated by using laser direct structuring (LDS). This technique adds power to the trend towards miniaturisation in the electronics industry and provides product developers with new design opportunities. The projects which Multiple Dimensions, one of the world’s foremost suppliers in this field, have realized illustrate the diversity of possible applications for 3D-MID. They simplify the operation of household appliances, improve driver experience in power steering systems and open up new ways of saving space. For example in sensing and industrial electronics. Johannes Schmid, Managing Director of Multiple Dimensions explains how these fine traces on formed plastic are transforming industrial production. The basis of all 3D-MID applications is a thermoplastic material: “Using injection- moulding, we first manufacture the part to fit the customer’s application. We use different types of thermoplastic, which contain an additive that can be activated by laser,” says Mr. Schmid, describing the underlying principles of the technology. A laser ray then engraves the surface of the plastic and activates the additive. A copper bath then follows, which lets the conductive traces form directly on the thermoplastic. Depending on the type of application, the Mechatronic Integrated Devices may have to be extremely robust or temperature-resistant. “Some even have to be acid or sweat-resistant, for example applications for hearing aids or headphones,” continues the Swiss executive. In a final step, a barrier layer of nickel is applied and then conditioned with a thin layer of gold to ensure good solderability. What differentiates the company from the competition is that it produces traces in almost microscopically small dimensions. “Our manufacturing expertise is capable of competing with anyone in the world. Especially our uniquely fine trace width and the narrow spacing between traces.” Most suppliers are currently working with 300 – 400 µm spacing between traces. “At Multiple Dimensions however the technological limit for trace width is 80 µm,” states Schmid. “These fine structures are now often used in Point of Sales (POS) terminals as a protection from hacking attacks. The fine traces allow attacks on the data in the payment cards to be detected.”
From washing machines to steering wheelsIt is the trace width and spacing between the traces that differentiates the top players in the new 3D-MID technology from the rest of the pack. It is the main factor affecting the degree of miniaturisation. Additionally, it is decisive in terms of the number of functions that can be integrated in a component. There are already many concrete examples of applications using the technology: “We manufacture for a range of very diverse industries. I’m sure you are familiar with the rotary switches for programme selection in washing machines. These switches are normally made of a whole kit of small mechanical parts – with our 3D-Mechatronic Integrated Devices technology none of these are now needed.” The washing programme is selected using a capacitive switch, i.e. virtually touch-free. This has far-reaching consequences: Unlike with a mechanical solution, there is no friction to wear out the parts. “Our operator control device has a much simpler design, costs less to produce and on top of that, it has a longer service life,” says Schmid. The Swiss company manufactures sensors for the automotive industry which are used to measure the torque of steering wheels. “Depending on the position and the measured value, the drive of the power steering is increased or decreased. The more accurate the measurement, then the more directly the vehicle response is felt.” Just like in the example of the washing-machine, the conventional solution contains numerous mechanical parts. When all these parts work together, deviations and tolerances cumulate and impair the driving experience. “We are able to eliminate an entire chain of tolerances,” explains Schmid. The technology not only saves components and costs, it also makes the application more precise and efficient. And last but not least, it increases the user’s driving pleasure
A maximum amount of functionality in minimal spaceExceptional functional integration in reduced space is demonstrated by a solution currently produced by Multiple Dimensions for a toy manufacturer. For enhanced player experience, an electronic circuit has been built into a tiny space in a plastic component – including a battery, a capacitive switch and an LED. “There simply would not have been enough space there for a printed circuit board. Here too, the operating control device, in this case a capacitive switch, is totally wear-free, there is no mechanical contact.” In future, the new 3D-Mechatronic Integrated Devices technology will also be used in human-like robots. In Biel currently, experts from Multiple Dimensions are equipping the fingertips of a robotic hand with conductive traces. The surface of the robot’s tactile organ is covered with sensors, their pressure signals are routed centrally to a connector. “Thanks to our 3D technology, we can place the required electronics accurately in spite of the complexity of working with a curved surface,” Schmid remarks, emphasising the advantages of three-dimensional processing.
The trend towards miniaturisation is growing in importance in everyday lifeCustomers of Multiple Dimensions benefit from the potential of the new technology at many levels, including financially. “We don’t just offer our state-of-the-art methodology and expertise that is unique in the world today; we also deliver it at a lower cost than many of our competitors.” All production steps are fully automated and performed in-house at Multiple Dimensions. “We cover the complete process chain, from the injection-moulding process to laser processing and galvanisation, and even go as far as populating the electronic components. The saves transport costs and, most of all, time; savings that we are happy to pass on to our customers,” declares Johannes Schmid. The Managing Director of Multiple Dimensions is convinced that as far as the development potential of 3D-Mechatronic Integrated Devices technology is concerned, the end of the road is still a long way off. “Advances in miniaturisation which are being made in all areas of our industrial society, combined with the trend to intelligent connectors for Industry 4.0, ensure that 3D-MID technology will be used even more widely in future.”
LDS Antenna DesignAntenna design with Laser Direct Structuring (LDS) technology offers the designers a huge flexibility. The LDS technology is the most powerful 3D manufacturing technology available. In the past decade, over 1 Billion LDS antennas have been produced. With LDS technology, antenna designers are enabled to create very powerful antenna designs with new degrees of freedom in three-dimensions. Multi-band, Wi-Fi, Bluetooth, GSM, CDMA, Cellular 3G, 4G LTE and emerging 5G frequencies are served. LDS antennas cover the full spectrum of todays and tomorrow’s mobile RF devices. LDS has the power reduce component count and miniaturize RF devices. When selecting an LDS antenna the designer dispenses with additional Flex PCB or wire antennas. The conductive surface is applied directly on the thermoplastic substrate. With LDS, the structure is the substrate. A total cost analysis confirms that LDS function integration and flexibility saves money. The power of LDS flexibility is also seen in the design phase – multiple antenna iterations can be laid down on the 3D structure in one batch, helping antenna designers secure the best performing antenna length and shape. LDS technology gives our clients the power to design and deliver great RF antenna performance quickly and reduce Time-to-Market. LDS technology is used in a great variety of antenna applications including:
Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017. Visit us at:
Three-dimensional molded interconnect devices
Three-dimensional molded interconnect devices are a welcome addition to conventional printed circuit boards and are particularly well suited to Industry 4.0 applications. The example of a smoke detector illustrates how design and functional integration are simplified with this technology. Whether rigid or flexible, printed circuit boards are a virtually indispensable part of electronic devices as interconnect devices. Plastic molded interconnect devices (MIDs) offer many advantages with regard to connection technology, including the combination of electrical and mechanical functions in a single component. This makes it possible to use the housing and other molded inner structures as an interconnect device, sometimes eliminating the need for a PCB. Three-dimensional functional integration The MID is a multifunctional component with sensors arranged and aligned with a high precision combined with an RFID antenna for sending and receiving signals. This concentration of functions on a single carrier material enables development engineers to create three-dimensional microelectromechanical systems (MEMS). MIDs are ideally suited for this purpose, particularly when manufacturing large and very large volumes. MID technology in detail Download and read the complete article: 3D-MID in pole position