Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017. Visit us at:
Three-dimensional molded interconnect devices
Three-dimensional molded interconnect devices are a welcome addition to conventional printed circuit boards and are particularly well suited to Industry 4.0 applications. The example of a smoke detector illustrates how design and functional integration are simplified with this technology. Whether rigid or flexible, printed circuit boards are a virtually indispensable part of electronic devices as interconnect devices. Plastic molded interconnect devices (MIDs) offer many advantages with regard to connection technology, including the combination of electrical and mechanical functions in a single component. This makes it possible to use the housing and other molded inner structures as an interconnect device, sometimes eliminating the need for a PCB. Three-dimensional functional integration The MID is a multifunctional component with sensors arranged and aligned with a high precision combined with an RFID antenna for sending and receiving signals. This concentration of functions on a single carrier material enables development engineers to create three-dimensional microelectromechanical systems (MEMS). MIDs are ideally suited for this purpose, particularly when manufacturing large and very large volumes. MID technology in detail Download and read the complete article: 3D-MID in pole position
Come visit us at Booth #754 ! The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.
The Multiple Dimensions team thanks for the numerous visits at the Electronica 2016 in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology. Insight in 3D-MID production