News: 3D-MID-Technology | Multiple Dimensions

Automotive Swissmem

Posted on 15. April 2016 by Thomas Hess

Swissmem Specialist Group Automotive Multiple Dimensions is a founding member of the newly formed specialist group automotive at Swissmem (association of the Swiss mechanical, electrical and engineering industries)Swissmem strengthen the development of their members’ relationship and information network,

Posted in News

SMT Hybrid Packaging April 26th – 28th

Posted on 14. April 2016 by Thomas Hess

Visit us in hall 6 booth 318 and discover the potential that’s offered by the 3D-MID technology (Molded Interconnect Device)! At the SMT / Hybrid Packaging in Nuremberg we show how you can optimize your products by the use of 3D-MID.

Posted in Exhibition

3D-Packaging with 3D-MID Technology

Posted on 11. October 2014 by Thomas Hess

The trend toward miniaturization and functional integration in the electronic industry is unbeaten. 3D-packaging, Package on Package (PoP) or System in Package (SiP) are key technologies to realize high functional integration into the smallest space, but PoP or SiP deal with packaging on chip level only. The chip itself has to be assembled to a

Posted in Publication