News – Page 3 – Multiple Dimensions

Function integration and miniaturization with 3D MID

3D MID supports miniaturization

Posted on 24. May 2016 by Thomas Hess

Innovation breakthrough in circuit carriers

MULTIPLE DIMENSIONS AG, with its 3D MID (Molded Interconnect Devices) technology, supports modularization and miniaturization of electronics. Product developers extend forms from flat conventional forms into three dimensions and enjoy the highest degree of design freedom.

Posted in Publication

3D-MID @ Electronica in Munich

Posted on 23. May 2016 by Thomas Hess

From November 8th – 11th get informed in the halls of Electronica on the exciting trends and latest developments of 3D-MID technology.

Posted in Exhibition

Automotive Swissmem

Posted on 15. April 2016 by Thomas Hess

Swissmem Specialist Group Automotive Multiple Dimensions is a founding member of the newly formed specialist group automotive at Swissmem (association of the Swiss mechanical, electrical and engineering industries)Swissmem strengthen the development of their members’ relationship and information network,

Posted in News

SMT Hybrid Packaging April 26th – 28th

Posted on 14. April 2016 by Thomas Hess

Visit us in hall 6 booth 318 and discover the potential that’s offered by the 3D-MID technology (Molded Interconnect Device)! At the SMT / Hybrid Packaging in Nuremberg we show how you can optimize your products by the use of 3D-MID.

Posted in Exhibition

3D-Packaging with 3D-MID Technology

Posted on 11. October 2014 by Thomas Hess

The trend toward miniaturization and functional integration in the electronic industry is unbeaten. 3D-packaging, Package on Package (PoP) or System in Package (SiP) are key technologies to realize high functional integration into the smallest space, but PoP or SiP deal with packaging on chip level only. The chip itself has to be assembled to a

Posted in Publication