The Multiple Dimensions team thanks for the numerous visits at the Electronica fair in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.
3D-MID @ Electronica in Munich
From November 8th – 11th get informed in the halls of Electronica on the exciting trends and latest developments of 3D-MID technology.
SMT Hybrid Packaging April 26th – 28th
Visit us in hall 6 booth 318 and discover the potential that’s offered by the 3D-MID technology (Molded Interconnect Device)!
At the SMT / Hybrid Packaging in Nuremberg we show how you can optimize your products by the use of 3D-MID.