Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017.
Visit us at:
Illuminotronica & Expo Ferroviaria
Join Multiple Dimensions at DMEMS May 3 & 4 in Del Mar (CA)
Come visit us at Booth #754 !
The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.
The Multiple Dimensions team thanks for the numerous visits at the Electronica fair in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.
3D-MID @ Electronica in Munich
From November 8th – 11th get informed in the halls of Electronica on the exciting trends and latest developments of 3D-MID technology.
SMT Hybrid Packaging April 26th – 28th
Visit us in hall 6 booth 318 and discover the potential that’s offered by the 3D-MID technology (Molded Interconnect Device)!
At the SMT / Hybrid Packaging in Nuremberg we show how you can optimize your products by the use of 3D-MID.