3D-MID on Electronica

30.11.2016
Electronica 2016

The Multiple Dimensions team thanks for the numerous visits at the Electronica fair in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.

3D-MID @ Electronica

23.05.2016
3D-MID @ Electronica in Munich

From November 8th – 11th get informed in the halls of Electronica on the exciting trends and latest developments of 3D-MID technology.

smt_hybrid_packaging

14.04.2016
SMT Hybrid Packaging April 26th – 28th

Visit us in hall 6 booth 318 and discover the potential that’s offered by the 3D-MID technology (Molded Interconnect Device)!
At the SMT / Hybrid Packaging in Nuremberg we show how you can optimize your products by the use of 3D-MID.