Innovative Technology 3D-MID shown on two expos in Italy

10.07.2017
Exhibitions Italy

Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017.

Visit us at:

Illuminotronica & Expo Ferroviaria

3D-MID-Technology showed by Multiple Dimensions

21.04.2017
Join Multiple Dimensions at DMEMS May 3 & 4 in Del Mar (CA)

Come visit us at Booth #754 !

The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.

3D-MID on Electronica 2016

30.11.2016
Electronica 2016

The Multiple Dimensions team thanks for the numerous visits at the Electronica 2016 in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.

Insight in 3D-MID production

3D-MID @ Electronica

23.05.2016
3D-MID @ Electronica in Munich

From November 8th – 11th get informed in the halls of Electronica on the exciting trends and latest developments of 3D-MID technology.


14.04.2016
SMT Hybrid Packaging April 26th – 28th

Visit us in hall 6 booth 318 and discover the potential that’s offered by the 3D-MID technology (Molded Interconnect Device)!
At the SMT / Hybrid Packaging in Nuremberg we show how you can optimize your products by the use of 3D-MID.