10.07.2017
Exhibitions Italy
Esseti Circuiti, Italian partner of Multiple Dimensions is going to exhibit the 3D-MID technology on two expos in Italy in October 2017.
Visit us at:
Illuminotronica & Expo Ferroviaria
21.04.2017
Join Multiple Dimensions at DMEMS May 3 & 4 in Del Mar (CA)
Come visit us at Booth #754 !
The Del Mar Electronics and Manufacturing Show (DMEMS) brings together thousands of visitors and hundreds of exhibitors into a great electronics event.
30.11.2016
Electronica 2016
The Multiple Dimensions team thanks for the numerous visits at the Electronica fair in Munich. The interesting conversations confirm the growing interest in the 3D-MID technology.
23.05.2016
3D-MID @ Electronica in Munich
From November 8th – 11th get informed in the halls of Electronica on the exciting trends and latest developments of 3D-MID technology.
14.04.2016
SMT Hybrid Packaging April 26th – 28th
Visit us in hall 6 booth 318 and discover the potential that’s offered by the 3D-MID technology (Molded Interconnect Device)!
At the SMT / Hybrid Packaging in Nuremberg we show how you can optimize your products by the use of 3D-MID.