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Innovative Technology 3D-MID shown on two expos in Italy
Veröffentlicht am 10. Juli 2017 von Thomas Hess

Esseti Circuiti, der italienische Partner von Multiple Dimensions stellt die 3D-MID-Technologie an zwei Messen in Italien aus.

Kommen Sie uns im Oktober auf unseren Messenstand besuchen an der

Illuminotronica & Expo Ferroviaria

It would be a pleasure for us introducing you into the innovative technology of Molded Interconnect Devices (MID) and discuss potential applications with you.

ILLUMINOTRONICA – 12-14 OCTOBER 2017, PADOVA,ITALY

STAND N. C28-C30

Illuminotronica is the best Italian exhibition where you meet the best important  Domotic, LED Lighting and Securit Manufacturer. During this exhibition you can know new technologies and material for this special applications.
Esseti will share the booth with Clever srl.

EXPO FERROVIARIA – 3 – 5 OCTOBER 2017, RHO FIERA, MILAN, ITALY

STAND N. 670

Milan hosts Italy’s leading rail event. EXPO Ferroviaria, Italy’s showcase event for railway equipment, products and services, has a new venue -Fiera Milano- and new autumn dates. Strongly supported by the industry, these changes signal a new phase in the development of Italy’s only regular exhibition of railway technology, and will further boost its proven record of success in attracting visits by high-ranking rail professionals.

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