LDS Antenna DesignAntenna design with Laser Direct Structuring (LDS) technology offers the designers a huge flexibility. The LDS technology is the most powerful 3D manufacturing technology available. In the past decade, over 1 Billion LDS antennas have been produced. With LDS technology, antenna designers are enabled to create very powerful antenna designs with new degrees of freedom in three-dimensions. Multi-band, Wi-Fi, Bluetooth, GSM, CDMA, Cellular 3G, 4G LTE and emerging 5G frequencies are served. LDS antennas cover the full spectrum of todays and tomorrow’s mobile RF devices. LDS has the power reduce component count and miniaturize RF devices. When selecting an LDS antenna the designer dispenses with additional Flex PCB or wire antennas. The conductive surface is applied directly on the thermoplastic substrate. With LDS, the structure is the substrate. A total cost analysis confirms that LDS function integration and flexibility saves money. The power of LDS flexibility is also seen in the design phase – multiple antenna iterations can be laid down on the 3D structure in one batch, helping antenna designers secure the best performing antenna length and shape. LDS technology gives our clients the power to design and deliver great RF antenna performance quickly and reduce Time-to-Market. LDS technology is used in a great variety of antenna applications including:
Three-dimensional molded interconnect devices
Three-dimensional molded interconnect devices are a welcome addition to conventional printed circuit boards and are particularly well suited to Industry 4.0 applications. The example of a smoke detector illustrates how design and functional integration are simplified with this technology. Whether rigid or flexible, printed circuit boards are a virtually indispensable part of electronic devices as interconnect devices. Plastic molded interconnect devices (MIDs) offer many advantages with regard to connection technology, including the combination of electrical and mechanical functions in a single component. This makes it possible to use the housing and other molded inner structures as an interconnect device, sometimes eliminating the need for a PCB. Three-dimensional functional integration The MID is a multifunctional component with sensors arranged and aligned with a high precision combined with an RFID antenna for sending and receiving signals. This concentration of functions on a single carrier material enables development engineers to create three-dimensional microelectromechanical systems (MEMS). MIDs are ideally suited for this purpose, particularly when manufacturing large and very large volumes. MID technology in detail Download and read the complete article: 3D-MID in pole position
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