Our 5 process steps
Multiple Dimensions possesses state-of-the-art infrastructure for each process step – all under one roof. The result is a significantly higher throughput than with conventional production.
![]() 1Creation Of Injection Molding Tool |
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An injection molding tool made for series production forms the circuit substrate. The cavity of the precision-machined steel tool determines the shape and surface texture of the finished part. With this three-dimensional design there are only few limits. | |
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![]() 2Plastic Injection Molding |
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The manufacturing of the circuit substrate takes place in the injection molding process. Thermoplastic material is liquefied and injected under pressure into the mold. After cooling and opening the tool, the formed circuit carrier is removed. | |
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![]() 3Laser-Direct-Structuring (LDS) |
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The thermoplastic material of the circuit substrate is doped with a laser-activated metal compound. The laser then scribes the conductor tracks by ablating the surface slightly while particles are simultaneously dislodged from the metal compound and dispersed into the microscopically rough surface. | |
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![]() 4Chemical Plating |
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The metal particles form the nuclei for plating. In electroless copper, nickel, and gold baths the interconnection layers are built on the lasered surfaces with sharp edges and clean contours. A three-dimensional circuit carrier emerges. | |
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![]() 5Electronic Assembly |
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The circuit carrier can be populated with components of any kind. Its three-dimensional shape allows the targeted application and alignment of SMT sensors, LED lights and countless other electronic components. |