Our 5 process steps

Multiple Dimensions possesses state-of-the-art infrastructure for each process step – all under one roof. The result is a significantly higher throughput than with conventional production.

1 Creation Of Injection Molding Tool
An injection molding tool made for series production forms the circuit substrate. The cavity of the precision-machined steel tool determines the shape and surface texture of the finished part. With this three-dimensional design there are only few limits.

1

Creation Of Injection Molding Tool

An injection molding tool made for series production forms the circuit substrate. The cavity of the precision-machined steel tool determines the shape and surface texture of the finished part. With this three-dimensional design there are only few limits.

2 Plastic Injection Molding
The manufacturing of the circuit substrate takes place in the injection molding process. Thermoplastic material is liquefied and injected under pressure into the mold. After cooling and opening the tool, the formed circuit carrier is removed.

2

Plastic Injection Molding

The manufacturing of the circuit substrate takes place in the injection molding process. Thermoplastic material is liquefied and injected under pressure into the mold. After cooling and opening the tool, the formed circuit carrier is removed.

3 Laser-Direct-Structuring (LDS)
The thermoplastic material of the circuit substrate is doped with a laser-activated metal compound. The laser then scribes the conductor tracks by ablating the surface slightly while particles are simultaneously dislodged from the metal compound and dispersed into the microscopically rough surface.

3

Laser-Direct-Structuring (LDS)

The thermoplastic material of the circuit substrate is doped with a laser-activated metal compound. The laser then scribes the conductor tracks by ablating the surface slightly while particles are simultaneously dislodged from the metal compound and dispersed into the microscopically rough surface.

4 Chemical Plating
The metal particles form the nuclei for plating. In electroless copper, nickel, and gold baths the interconnection layers are built on the lasered surfaces with sharp edges and clean contours. A three-dimensional circuit carrier emerges.

4

Chemical Plating

The metal particles form the nuclei for plating. In electroless copper, nickel, and gold baths the interconnection layers are built on the lasered surfaces with sharp edges and clean contours. A three-dimensional circuit carrier emerges.

5 Electronic Assembly
The circuit carrier can be populated with components of any kind. Its three-dimensional shape allows the targeted application and alignment of SMT sensors, LED lights and countless other electronic components.

5

Electronic Assembly

The circuit carrier can be populated with components of any kind. Its three-dimensional shape allows the targeted application and alignment of SMT sensors, LED lights and countless other electronic components.